Silicon heat pipes used as thermal spreaders

被引：4

作者：

Gillot, C ^{[1
]}

Avenas, Y ^{[1
]}

Cézac, N ^{[1
]}

Poupon, G ^{[1
]}

Schaeffer, C ^{[1
]}

Fournier, E ^{[1
]}

机构：

[1] CEA, DRT, LETI, DTS,GRE, F-38054 Grenoble 9, France

来源：

ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS | 2002年

关键词：

heat pipe; silicon; spreading; miniature; groove; vapor;

D O I：

10.1109/ITHERM.2002.1012574

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Models of the structure were developed to calculate heat transfer limitations and temperature drops. A brass / water prototype was fabricated to demonstrate the feasibility of heat spreading using this type of heat pipe. Simulation and experimental results obtained with the prototype are described. The dissipated power reached 110 W/cm(2) without heat transfer limitations. The results are then extended to the design of this type of heat pipe in silicon. Thermal performance was calculated. Simulation, experimental results and the fabrication process are presented.

引用

页码：1052 / 1057

页数：6

共 50 条

[31] Rigorous series solution for diamond heat spreaders with temperature-dependent thermal conductivity used in microwave power devices
Hui, Ping
Tso, Chih Ping
Tan, Hong Siang
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1996, 35 (11): : 5796 - 5804
[32] An investigation into the effective thermal conductivity of vapour chamber heat spreaders
Velardo, Jason
Singh, Randeep
Date, Ashwin
Date, Abhijit
1ST INTERNATIONAL CONFERENCE ON ENERGY AND POWER, ICEP2016, 2017, 110 : 256 - 261
[33] THERMAL MANAGEMENT WITH GRAPHENE LATERAL HEAT SPREADERS: A FEASIBILITY STUDY
Subrina, Samia
Kotchetkov, Dmitri
Balandin, Alexander A.
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
[34] Assembly of MCM thermal solution utilizing individual heat spreaders
Edwards, David L.
Hering, Ronald L.
Long, David C.
Singh, Surinder
TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, : 157 - +
[35] A rigorous series solution for diamond heat spreaders with temperature-dependent thermal conductivity used in microwave power devices
Hui, P
Tso, CP
Tan, HS
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (11): : 5796 - 5804
[36] Silicon-Packaged GaN Power HEMTs with Integrated Heat Spreaders
Herrault, F.
Yajima, M.
Margomenos, A.
Corrion, A.
Shinohara, K.
Micovic, M.
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1109 - 1114
[37] Thermal performance of sintered heat pipes
Ong, K. S.
Tan, M. H.
Chong, K. H.
INTERNATIONAL SYMPOSIUM GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019), 2019, 2157
[38] Equivalent thermal conductivity of heat pipes
Lu, Zesheng
Ma, Binghui
FRONTIERS OF MECHANICAL ENGINEERING, 2008, 3 (04) : 462 - 466
[39] Thermal characterization of pulsating heat pipes
Xu, Guoping
Liang, Shibin
Vogel, Marlin
2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, 2006, : 552 - +
[40] Effective thermal conductivity of heat pipes
ElNasr, AA
ElHaggar, SM
HEAT AND MASS TRANSFER, 1996, 32 (1-2): : 97 - 101

← 1 2 3 4 5 →