Copper Balls Interconnection Technology for 60 GHz Band 3-D System-in-Package Modules

被引：0

作者：

Yoshida, Satoshi ^{[1
]}

Tanifuji, Shoichi ^{[1
]}

Kameda, Suguru ^{[1
]}

Suematsu, Noriharu ^{[1
]}

Takagi, Tadashi ^{[1
]}

Tsubouchi, Kazuo ^{[1
]}

机构：

[1] Tohoku Univ, Elect Commun Res Inst, Aoba Ku, Katahira 2-1-1, Sendai, Miyagi 9808577, Japan

来源：

2010 ASIA-PACIFIC MICROWAVE CONFERENCE | 2010年

关键词：

millimeter-wave; 60; GHz; system-in-package; small terminal; WPAN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we propose a novel copper halls interconnection technology for 60GHz band 3-D system-in-package (SIP) modules for 10 mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 mu m is used for interconnection between the substrates. Ground copper halls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70 GHz for S-21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

引用

页码：904 / 907

页数：4

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