HiRel double sided package for Si/SiC power module

被引：2
|
作者：
Borowy, B. [1 ]
Casey, L. [1 ]
Davis, G. [1 ]
Connell, J. [2 ]
机构：
[1] SatCon Appl Technol, 27 Drydock Ave, Boston, MA 02210 USA
[2] SatCon Technol Co, Adv Thermal Technol, Boston, MA 02210 USA
来源：
2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL | 2006年
关键词：
D O I：
10.1109/RELPHY.2006.251288
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：613 / +
页数：2
相关论文
共 50 条
  • [41] 6.5 kV Si/SiC Hybrid Power Module: An Ideal Next Step?
    Huang, Alex Q.
    Song, Xiaoqing
    Zhang, Liqi
    2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 64 - 67
  • [42] Automatic Layout Optimization of a Double Sided Power Module Regarding Thermal and EMC constraints
    Mandray, Sylvain
    Guichon, Jean-Michel
    Schanen, Jean-Luc
    Vieillard, Sebastien
    Bouzourene, Arezki
    2009 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION, VOLS 1-6, 2009, : 547 - +
  • [43] A Double-Sided Cooling Approach of Discrete SiC MOSFET Device Based on Press-Pack Package
    Yao, Ran
    Zhu, Zheyan
    Li, Hui
    Lai, Wei
    Chen, Xianping
    Iannuzzo, Francesco
    Liu, Renkuan
    Luo, Xiaorong
    IEEE OPEN JOURNAL OF POWER ELECTRONICS, 2024, 5 : 1629 - 1640
  • [44] Thermo-Mechanical Simulations of SiC Power Modules with Single and Double Sided Cooling
    Brinkfeldt, Klas
    Edwards, Michael
    Ottosson, Jonas
    Neumaier, Klaus
    Zschieschang, Olaf
    Otto, Alexander
    Kaulfersch, Eberhard
    Andersson, Oag
    2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [45] Advanced SiC Power Technology and Package
    Kim, ByongJin
    Bolotnikov, Alexander
    Jeong, Helen
    Kim, Chandong
    Das, Hrishkesh
    Ponram, Ganesh
    2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM, 2023,
  • [46] A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module
    Ning, Puqi
    Lei, Thomas Guangyin
    Wang, Fei
    Lu, Guo-Quan
    Ngo, Khai D. T.
    Rajashekara, Kaushik
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2010, 25 (08) : 2059 - 2067
  • [47] A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module
    Xiaoshuang Hui
    Puqi Ning
    Tao Fan
    Yuhui Kang
    Kai Wang
    Yunhui Mei
    Guangyin Lei
    CES Transactions on Electrical Machines and Systems, 2024, 8 (01) : 72 - 79
  • [48] A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module
    Hui, Xiaoshuang
    Ning, Puqi
    Fan, Tao
    Kang, Yuhui
    Wang, Kai
    Mei, Yunhui
    Lei, Guangyin
    CES TRANSACTIONS ON ELECTRICAL MACHINES AND SYSTEMS, 2024, 8 (01) : 72 - 79
  • [49] Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device
    Hu, Borong
    Gonzalez, Jose Ortiz
    Ran, Li
    Ren, Hai
    Zeng, Zheng
    Lai, Wei
    Gao, Bing
    Alatise, Olayiwola
    Lu, Hua
    Bailey, Christopher
    Mawby, Phil
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017, 17 (04) : 727 - 737
  • [50] Multi-Physics Coupling Analysis and Optimization Design of SiC MOSFET Power Module Package Insulation
    Wang, Yalin
    Li, Wenyi
    Ding, Yi
    Sun, Hao
    Yin, Yi
    2022 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2022,
12345