Experimental study of grain boundary orientations in multi-crystalline silicon

被引:8
|
作者
Duffar, T. [1 ]
Nwosu, C. T. [1 ]
Asuo, I. M. [1 ]
Muzy, J. [1 ]
Chau, N. D. Q. [1 ]
Du Terrail-Couvat, Y. [1 ]
Robaut, F. [2 ]
机构
[1] SIMaP EPM, F-38402 St Martin Dheres, France
[2] INP Grenoble, CMTC, F-38402 St Martin Dheres, France
关键词
Planar defects; Solidification; Growth from melt; Semiconducting silicon; Grain boundaries; TWINNING OCCURRENCE; SOLIDIFICATION; GROWTH;
D O I
10.1016/j.jcrysgro.2013.12.047
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Some peculiarities of straight and zig-zag grain boundaries in multi-crystalline Si ingots were analyzed by Scanning Electron Microscopy-Electron BackScatter Diffraction (SEM-EBSD) and Three Dimensional (3D) grain boundary reconstruction. In the cases where straight grain boundaries were perpendicular to facing {111} planes in the two neighboring grains, they were found parallel, within the measurement accuracy, to the bisector of the two facing {111} planes. This is in agreement with the theory predicting the existence of Facetted-Facetted grooves during the growth of multicrystalline Si. Another grain boundary was corresponding to the predicted Facetted-Rough groove. It was found that the zig-zag grain boundaries were successively composed of {111} twin planes and ((4) over bar 11)/(01 1) planes, so that the two grains are always in Sigma 3 relationship. The phenomenon leading to the formation mechanism for these boundaries remains a subject for research. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:404 / 408
页数:5
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