Testing of the Thermal Model of Microprocessor

被引：0
|
作者：
Markowski, Piotr [1 ]
Gierczak, Miroslaw [1 ]
Dziedzic, Andrzej [1 ]
机构：
[1] Wroclaw Univ Sci & Technol, Fac Microsyst Elect & Photon, Wybrzeze Wyspianskiego 27, PL-50370 Wroclaw, Poland
来源：
2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The thermal, laboratory model of multi-core microprocessor was fabricated and analyzed. It consists of four separately powered thick-film resistors. Moreover, thermoelectric temperature sensor, suitable for monitoring of small and dynamic temperature changes on the microprocessor/heat sink border, was designed and tested. It consists of two separate substrates connected by nickel and silver wires. It's resolution is 113 mu V/K. Static and dynamic measurements of the microprocessor model were carried out using the pyrometers or designed sensor.
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页数：4
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