Analytical Modeling of Microchannel Heat Sinks Using Microencapsulated Phase Change Material Slurry for Chip Cooling

The heat transfer of microchannel heat sinks using microencapsulated phase change material (MPCM) slurry as a novel cooling technique has been used in the chip cooling. In order to study the heat transfer performance of MPCM slurry across microchannel heat sinks thoroughly, the fin and porous media methods are used in this paper, respectively. Mathematical models of the heat transfer characteristics of MPCM slurry in microchannels are established under constant heat flux. Their analytical solutions are validated via comparing with the data from the published literature, which shows a reasonable agreement with them. The predictions from two methods show that there are significant differences for the fluid temperature distribution and overall Nusselt number. Some relationships among the overall heat transfer coefficient, porosity, volume concentration and particle diameter are revealed, and the results are compared with the single-phase fluid. (C) 2017 The Authors. Published by Elsevier Ltd.