Diffusional breakdown of nickel protective coatings on copper substrate in silver-copper eutectic melts

Diffusion couples with electrolessly plated nickel diffusion barriers between copper substrates and silver-copper eutectic alloys were tested at 800 degrees C and 850 degrees C, respectively. Growth of (Cui Ni, Ag) ternary solid solution into the melt was observed at both temperatures. The growth pattern changed from cellular to dendritic as the temperature was increased from 800 degrees C to 850 degrees C. The nonplanar growth morphology can be explained in terms of constitutional supercooling in the melt. Kinetics of (Cu, Ni, Ag) solid solution growth were found to be controlled by interdiffusion at the interface of the nickel barrier and the growing solid-state phase. Local breakdown of the nickel diffusion barrier started once the (Cu, Ni, Ag) solid solution reached the copper substrate. Silver diffused from the silver-copper melt, through the ternary solid solution, dissolving copper and forming silver-copper liquid along copper grain boundaries. Ultimately, the nickel barrier was totally converted to the ternary solid solution, broke up, and floated into the liquid. Dissolution of the copper substrate occurred subsequently. A thin layer of chromium undercoating proved to be very effective in extending the protection time of the nickel diffusion barrier, due to the extremely low solubility of both copper and silver in chromium at these test temperatures.