Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

The Tm-Ni-Co alloy films have been prepared by the sweep potential deposition technique. The surface appearance of Tm-Ni-Co alloy films was silver, smooth and adhesive. The surfaces of Tm-Ni-Co alloy films observed by scanning electron microscope (SEM) were uniform, adhesive and compact. The sizes of metallic grains were about 80-100 nm, 100-200 run, 50-60 nm, and 90-120 nm at 1 mV(.)s(-1), 5 mV(.)s(-1), 10 mV(.)s(-1) and 50 mV(.)s(-1), respectively. The Tm-Ni-Co alloy film was amorphous as proven by the X-ray diffraction (XRD).