Impacts of Fluorine-treatment on E-mode AlGaN/GaN MOS-HEMTs

被引:0
|
作者
Sun, X. [1 ]
Zhang, Y. [2 ]
Chang-Liao, K. S. [3 ]
Palacios, T. [2 ]
Ma, T. P. [1 ]
机构
[1] Yale Univ, New Haven, CT 06520 USA
[2] MIT, Cambridge, MA 02139 USA
[3] Natl Tsing Hua Univ, Hsinchu 30013, Taiwan
来源
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2014年
关键词
THRESHOLD-VOLTAGE;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
The impact of fluorine treatment on AlGaN/GaN MOS-HEMTs has been investigated. Fluorine was found to suppress pre-existing traps in MOS-HEMT, which improves the off-state at high temperatures. Fluorine doping and associated etching, however, also generates slow border traps and fast interface states that degrade the MOS-HEMT performance. Multi-faceted mechanisms for drain current degradation due to F-doping and gate-recess-etch have been investigated in enhancement-mode MOS-HEMTs.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] Improved Current Collapse in Recessed AlGaN/GaN MOS-HEMTs by Interface and Structure Engineering
    Hu, Qianlan
    Hu, Ben
    Gu, Chengru
    Li, Tiaoyang
    Li, Sichao
    Li, Shengman
    Li, Xuefei
    Wu, Yanqing
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (11) : 4591 - 4596
  • [22] Channel scaling of hybrid GaN MOS-HEMTs
    Li, Zhongda
    Chow, T. Paul
    SOLID-STATE ELECTRONICS, 2011, 56 (01) : 111 - 115
  • [23] High Threshold Voltage in GaN MOS-HEMTs Modulated by Fluorine Plasma and Gate Oxide
    Zhang, Yuhao
    Sun, Min
    Joglekar, Sameer J.
    Palacios, Tomas
    2013 71ST ANNUAL DEVICE RESEARCH CONFERENCE (DRC), 2013, : 141 - 142
  • [24] Double-Channel E-Mode AlGaN/GaN HEMTs with an Electron-Blocking-Layer Structure
    Chang, Yang-Hua
    Yang, Lu-Hao
    2017 INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2017,
  • [25] Ferroelectric Gate AlGaN/GaN E-Mode HEMTs With High Transport and Sub-Threshold Performance
    Zhu, Jiejie
    Chen, Lixiang
    Jiang, Jie
    Lu, Xiaoli
    Yang, Ling
    Hou, Bin
    Liao, Min
    Zhou, Yichun
    Ma, Xiaohua
    Hao, Yue
    IEEE ELECTRON DEVICE LETTERS, 2018, 39 (01) : 79 - 82
  • [26] Reliability of enhancement-mode AlGaN/GaN HEMTs fabricated by fluorine plasma treatment
    Yi, Congwen
    Wang, Ruonan
    Huang, Wei
    Tang, Wilson C. -W.
    Lau, K. M.
    Chen, Kevin J.
    2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, : 389 - 392
  • [27] High Temperature Operation of E-Mode and D-Mode AlGaN/GaN MIS-HEMTs With Recessed Gates
    Lee, Hanwool
    Ryu, Hojoon
    Kang, Junzhe
    Zhu, Wenjuan
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2023, 11 : 167 - 173
  • [28] Experimental Study on Current Collapse of GaN MOSFETs, HEMTs and MOS-HEMTs
    Li, Z.
    Marron, T.
    Naik, H.
    Huang, W.
    Chow, T. P.
    2010 22ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2010, : 225 - 228
  • [29] Investigations of AlGaN/AlN/GaN MOS-HEMTs on Si Substrate by Ozone Water Oxidation Method
    Liu, Han-Yin
    Lee, Ching-Sung
    Hsu, Wei-Chou
    Tseng, Lung-Yi
    Chou, Bo-Yi
    Ho, Chiu-Sheng
    Wu, Chang-Luen
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (07) : 2231 - 2237
  • [30] Low Hysteresis Dispersion La2O3 AlGaN/GaN MOS-HEMTs
    Chiu, Hsien-Chin
    Lin, Chao-Wei
    Chen, Chao-Hung
    Yang, Chih-Wei
    Lin, Che-Kai
    Fu, Jeffrey S.
    Chang, Liann-Be
    Lin, Ray-Ming
    Hsueh, Kuang-Po
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (02) : H160 - H164