Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

被引：62
|
作者：
Xiong, Mingyue [1 ]
Zhang, Liang [1 ,2 ]
Sun, Lei [3 ]
He, Peng [2 ]
Long, Weimin [4 ]
机构：
[1] Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Jiangsu, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China
[3] Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China
[4] Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Henan, Peoples R China
来源：
VACUUM | 2019年 / 167卷
关键词：
TLP bonding; SnBi solder; Interfacial reaction; Void formation; MECHANICAL-PROPERTIES; INTERFACIAL REACTION; IMC GROWTH; PHASE; SN; CU; ORIENTATION; EVOLUTION; KINETICS; BEHAVIOR;
D O I：
10.1016/j.vacuum.2019.06.024
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu UP bonding solder joints was investigated. After bonding, the prism-type Cu(6)Sn(5 )Departure process intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J(2). The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.
引用
收藏
页码：301 / 306
页数：6
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