Integrated single and two-phase micro heat sinks under IGBT chips

被引：0
|
作者：
Gillot, C
Meysenc, L
Schaeffer, C
Bricard, A
机构：
来源：
IAS '97 - CONFERENCE RECORD OF THE 1997 IEEE INDUSTRY APPLICATIONS CONFERENCE / THIRTY-SECOND IAS ANNUAL MEETING, VOLS 1-3 | 1997年
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Experiments have been performed to assess the feasibility of single anti two-phase micro heat exchangers applied to the cooling of IGBT power components, After a brief recall of the principal characteristics of such heat exchangers, prototypes that have been built and tested are described, Then, the experimental measurements are compared to the predictions of the thermal and hydraulic performances with water and the inert fluorocarbon liquid (FC72) as coolant fluids.
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页码：994 / 999
页数：6
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