Low frequency noise in boron doped poly-SiGe resistors

被引:1
|
作者
Chen, KM [1 ]
Huang, GW [1 ]
Kuan, JF [1 ]
Huang, HJ [1 ]
Chang, CY [1 ]
Yang, TH [1 ]
机构
[1] Natl Nano Device Labs, Hsinchu 300, Taiwan
来源
2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2002年
关键词
D O I
10.1109/MWSYM.2002.1011641
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Low frequency noise in moderately and heavily boron doped poly-SiGe resistors was studied. The poly-SiGe films were grown using ultra-high vacuum chemical molecular epitaxy system. The Ge content is in the range of 0 similar to 36%. The low frequency noise was measured at room temperature. We find that the low frequency noise in poly-SiGe was almost independent of Ge content for heavily doped sample. However, for moderately doped sample, the noise decreases with the increase of Ge incorporation. This is due to the lower barrier height of grain boundary for high Ge content sample. The carrier mobility fluctuation model can explain this phenomenon.
引用
收藏
页码:405 / 408
页数:4
相关论文
共 50 条
  • [31] Effect of a silicon interlayer in low-temperature poly-SiGe thin film transistors
    Wang, AW
    Saraswat, KC
    ACTIVE MATRIX LIQUID CRYSTAL DISPLAYS TECHNOLOGY AND APPLICATIONS, 1997, 3014 : 133 - 140
  • [32] Source of Low Frequency Noise in SiGe HBTs
    王凯
    刘远
    邓婉玲
    Journal of Donghua University(English Edition), 2015, 32 (06) : 1052 - 1054
  • [33] Low frequency noise in Si/SiGe HFET
    Rodriguez, M
    Zerounian, N
    Herzog, HJ
    Hackbarth, T
    Aniel, F
    NOISE AND FLUCTUATIONS, 2005, 780 : 283 - 286
  • [34] SIGEM, low-temperature deposition of Poly-SiGe MEMs structures on standard CMOS circuits
    Ramos-Martos, J
    Ceballos-Cáceres, J
    Ragel-Morales, A
    Mora-Gutiérrez, JM
    Arias-Drake, A
    Lagos-Florido, MA
    Muñoz-Hinojosa, JM
    Mehta, A
    Verbist, A
    du Bois, B
    Kehr, K
    Leinenbach, C
    Van Aerde, S
    Spengler, J
    Witvrouw, A
    Smart Sensors, Actuators, and MEMS II, 2005, 5836 : 293 - 306
  • [35] Micromachined poly-SiGe bolometer arrays for infrared imaging and spectroscopy
    Leonov, VN
    Perova, NA
    De Moor, P
    Du Bois, B
    Goessens, C
    Grietens, B
    Verbist, A
    Van Hoof, C
    Vermeiren, J
    MEMS/MOEMS: ADVANCES IN PHOTONIC COMMUNICATIONS, SENSING, METROLOGY, PACKAGING AND ASSEMBLY, 2003, 4945 : 54 - 63
  • [36] Low-temperature crystallization of poly-SiGe thin-films by solid phase crystallization
    Nakahata, K
    Isomura, M
    Wakisaka, K
    POLYCRYSTALLINE SEMICONDUCTORS VII, PROCEEDINGS, 2003, 93 : 231 - 236
  • [37] Back-end-of-line poly-SiGe disk resonators
    Quévy, EP
    Paulo, A
    Basol, E
    Howe, RT
    King, TJ
    Bokor, G
    MEMS 2006: 19TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2006, : 234 - 237
  • [38] The use of functionally graded poly-SiGe layers for MEMS applications
    Witvrouw, A
    Mehta, A
    FUNCTIONALLY GRADED MATERIALS VIII, 2005, 492-493 : 255 - 260
  • [39] Growth and characterization of Poly-SiGe prepared by reactive thermal CVD
    Zhang, JJ
    Shimizu, K
    Hanna, JI
    AMORPHOUS AND NANOCRYSTALLINE SILICON SCIENCE AND TECHNOLOGY- 2004, 2004, 808 : 377 - 382
  • [40] An uncooled microbolometer infrared detector based on poly-SiGe thermistor
    Dong, L
    Yue, RF
    Liu, LT
    SENSORS AND ACTUATORS A-PHYSICAL, 2003, 105 (03) : 286 - 292