Influences of heating temperature on mechanical properties of polydimethylsiloxane

被引：172

作者：

Liu, Miao ^{[1
]}

Sun, Jianren ^{[1
]}

Chen, Quanfang ^{[1
]}

机构：

[1] Univ Cent Florida, Mech Mat & Aerosp Engn Dept, MEMS & Nanomat Lab, Orlando, FL 32816 USA

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2009年 / 151卷 / 01期

关键词：

Polydimethylsiloxane (PDMS); Mechanical properties; Influence of heating; PCR CHIP; FABRICATION; LITHOGRAPHY; GLASS;

D O I：

10.1016/j.sna.2009.02.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Polydimethylsiloxane (PDMS) has been widely used for fabrication of various microsystems. Heating is normally used in the fabrication process including curing and bonding, as well as operations like thermopneumatic actuation of PDMS. We report here the influences of heating temperature on mechanical properties (Young's modulus and ultimate tensile stress) of PDMS. Results have shown that for low temperatures, the mechanical properties are independent of heating time. Higher heating temperatures produce lower mechanical strength. The reduced mechanical strength is attributed to the thermal decomposition which starts at about 200 degrees C and reaches a peak at 310 degrees C. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：42 / 45

页数：4

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