Experimental evidence for liquid/solid interface instability caused by the stress in the solid during directional solidification under a strong magnetic field

被引:18
|
作者
Li, Xi [1 ,2 ]
Zhang, Yudong [3 ]
Fautrelle, Yves [2 ]
Ren, Zhongming [1 ]
Esling, Claude [3 ]
机构
[1] Shanghai Univ, Dept Mat Sci & Engn, Shanghai 200072, Peoples R China
[2] ENSHMG, SIMAP EPM Madylam, F-38402 St Martin Dheres, France
[3] Univ Metz, CNRS UMR 7078, LETAM, F-57045 Metz, France
关键词
Liquid/solid interface instability; Stress in solid; Strong magnetic field; STABILITY;
D O I
10.1016/j.scriptamat.2008.11.038
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The stress in the solid near the liquid/solid interface and its effect on the interface instability in directionally solidified Al-0.85 wt.% Cu alloy and pure Al under a strong (10 T) magnetic field has been investigated experimentally. Observing the liquid/solid interface shape and studying the electron backscatter diffraction of the interface substructure yields experimental evidence for the formation of the stress in the solid near the liquid/solid interface and the liquid/solid interface instability caused by the stress under a strong magnetic field. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:489 / 492
页数:4
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