A highly effective edge termination design for SiC planar high power devices

被引:13
|
作者
Pérez, R
Mestres, N
Blanque, S
Tournier, D
Jordà, X
Godignon, P
Nipoti, R
机构
[1] CSIC, ICMAB, Inst Ciencia Mat Barcelona, Bellaterra 08193, Spain
[2] CSIC, ICMAB, Inst Microelect Barcelona, Bellaterra 08193, Spain
[3] CNR, Ist Lamel, IT-40129 Bologna, Italy
来源
SILICON CARBIDE AND RELATED MATERIALS 2003, PRTS 1 AND 2 | 2004年 / 457-460卷
关键词
4H-SiC; pn diodes; device design; breakdown voltage; edge termination;
D O I
10.4028/www.scientific.net/MSF.457-460.1253
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Traditional junction termination extension (JTE) designs required precise control of dopant profiles in the JTE layer in order to achieve total depletion at the desired blocking voltage. To extend the HE range of impurity concentration for obtaining high breakdown values we have optimised and developed a new termination called "guards rings assisted HE structure" which has proved to show a high efficiency on breakdown capabilities. The new structure has been implemented on 1.7kV range 4H-SiC pn diodes. Reverse measurements have shown that a near ideal breakdown (approaching 95% of the ideal plane junction breakdown voltage) can be reached on diodes with the proposed termination and have confirmed the great reliability of this developed termination as compared to the classical JTE, double HE and guard rings.
引用
收藏
页码:1253 / 1256
页数:4
相关论文
共 50 条
  • [21] SiC high power devices
    Weitzel, CE
    Palmour, JW
    Carter, CH
    Moore, K
    Nordquist, KJ
    Allen, S
    Thero, C
    Bhatnagar, M
    COMPOUND SEMICONDUCTORS 1995, 1996, 145 : 599 - 604
  • [22] Area-Efficient Bevel-Edge Termination Techniques for SiC High-Voltage Devices
    Sung, Woongje
    Baliga, B. Jayant
    Huang, Alex Q.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (04) : 1630 - 1636
  • [23] Durable Edge Termination Design of SiC SBD against Humidity
    Ebihara, Kohei
    Niwa, Hiroki
    Murakami, Takeshi
    Fujiyoshi, Katsuhiro
    Nakata, Yosuke
    Okimoto, Shigeru
    Hatori, Kenji
    Nishikawa, Kazuyasu
    2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024, 2024, : 510 - 513
  • [24] Experimental analysis of planar edge terminations for high voltage 4H-SiC devices
    Soler, V.
    Berthou, M.
    Mihaila, A.
    Montserrat, J.
    Godignon, P.
    Rebollo, J.
    Millan, J.
    ESSDERC 2015 PROCEEDINGS OF THE 45TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2015, : 68 - 71
  • [25] Step JTE, an Edge Termination for UHV SiC Power Devices With Increased Tolerances to JTE Dose and Surface Charges
    Zhou, Cai-Neng
    Wang, Yan
    Yue, Rui-Feng
    Dai, Gang
    Li, Jun-Tao
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (03) : 1193 - 1196
  • [26] High performance SiC diodes based on an efficient planar termination
    Brezeanu, G
    Badila, M
    Udrea, F
    Millan, J
    Godignon, P
    Mihaila, A
    Amaratunga, G
    Brezeanu, M
    Boianceanu, C
    2003 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2003, : 27 - 36
  • [27] Planar edge terminations for high voltage 4H-SiC power MOSFETs
    Soler, Victor
    Berthou, Maxime
    Mihaila, Andrei
    Monserrat, Josep
    Godignon, Philippe
    Rebollo, Jose
    Millan, Jose
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2017, 32 (03)
  • [28] A novel metal field plate edge termination for power devices
    Bose, JVSC
    De Souza, MM
    Narayanan, EMS
    Ensell, G
    Pease, TJ
    Humphery, J
    MICROELECTRONICS JOURNAL, 2001, 32 (04) : 323 - 326
  • [29] Bevel Junction Termination Extension-A New Edge Termination Technique for 4H-SiC High-Voltage Devices
    Sung, Woongje
    Huang, Alex Q.
    Baliga, B. Jayant
    IEEE ELECTRON DEVICE LETTERS, 2015, 36 (06) : 594 - 596
  • [30] A Comparative Study 4500-V Edge Termination Techniques for SiC Devices
    Sung, Woongje
    Baliga, B. J.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (04) : 1647 - 1652