Comparison of joints by pulse electric current bonding and diffusion bonding

被引:6
|
作者
Chikui, N [1 ]
Furuhata, H
Ymaguchi, N
Ohashi, O
机构
[1] Niigata Univ, Grad Sch Sci & Technol, Niigata 9502181, Japan
[2] Ind Res Inst Nagano Prefecture, Niigata 3800928, Japan
关键词
pulse electric current bonding; diffusion bonding; SUS304 stainless steel;
D O I
10.2320/jinstmet.68.515
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Diffusion bonding process is one of solid state bonding processes that produces the joints by the application of pressure at elevated temperature without macroscopic deformation of the workpieces. For a conventional diffusion bonding technique, the joints are heated by the electrical resistance heaters, the induction high frequency heating and so on. Recently the pulse electric current bonding (PECB) process has received much attention as the advanced heating process at the bonding interface of joints. To clarify the difference in the bonding quality by the heating processes, the joints of the SUS304 stainless steel were made using pulse electric current bonding and induction high frequency heat bonding (IHB). The results of fracture surface and tensile strength of the joints showed that the bonding temperature to form the metallic bond by PECB was lower about 100degreesC than that of IHB. The decrease in bonding temperature was attributed to the heating at bonding interface locally, depending on the Joule heating by the contact resistance.
引用
收藏
页码:515 / 518
页数:4
相关论文
共 50 条
  • [32] High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints
    Na-Na Tian
    Cong-Lin Zhang
    Peng Lyu
    Jin-Tong Guan
    Jie Cai
    Qing-Feng Guan
    Shun Guo
    Rare Metals, 2024, 43 (06) : 2819 - 2831
  • [33] High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints
    Tian, Na-Na
    Zhang, Cong-Lin
    Lyu, Peng
    Guan, Jin-Tong
    Cai, Jie
    Guan, Qing-Feng
    Guo, Shun
    RARE METALS, 2024, 43 (06) : 2819 - 2831
  • [34] Anodic bonding driven by the pulse current signal of triboelectric nanogenerator
    Lin, Yuxing
    Nie, Jinhui
    Bai, Yu
    Li, Shuyao
    Xu, Liang
    Wang, Fan
    Ding, Yafei
    Tian, Jingwen
    Li, Yufang
    Chen, Xiangyu
    Shen, Honglie
    NANO ENERGY, 2020, 73
  • [35] Comparison of Gold Bonding with Mercury Bonding
    Kraka, Elfi
    Filatov, Michael
    Cremer, Dieter
    CROATICA CHEMICA ACTA, 2009, 82 (01) : 233 - 243
  • [36] Designing joints for adhesive bonding
    Electron Prod (London), 1988, 5 (33-37):
  • [37] ADHESIVES FOR BONDING STATIONARY JOINTS
    METELKIN, AF
    RUSSIAN ENGINEERING JOURNAL-USSR, 1968, 48 (08): : 48 - &
  • [38] Halogen bonding, chalcogen bonding, pnictogen bonding, tetrel bonding: origins, current status and discussion
    Brammer, Lee
    FARADAY DISCUSSIONS, 2017, 203 : 485 - 507
  • [39] Guidelines for using pulsed electric current bonding on stainless steel
    Chikui, N
    Furuhata, H
    Yamaguchi, N
    Ohashi, O
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 2005, 69 (08) : 715 - 718
  • [40] Pulsed electric current bonding of tungsten to copper with intermediate layer
    Nishimoto, Akio
    Akamatsu, Katsuya
    DESIGNING OF INTERFACIAL STRUCTURES IN ADVANCED MATERIALS AND THEIR JOINTS, 2007, 127 : 289 - +