Bifurcation of the Kirkendall plane during interdiffusion in the intermetallic compound β-NiAl

被引:48
|
作者
Paul, A [1 ]
Kodentsov, AA [1 ]
van Loo, FJJ [1 ]
机构
[1] Eindhoven Univ Technol, Lab Solid State & Mat Chem, NL-5600 MB Eindhoven, Netherlands
关键词
diffusion; Kirkendall plane; intermetallic compounds; NiAl;
D O I
10.1016/j.actamat.2004.05.028
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An experimental verification of the phenomenological approach introduced earlier [Phys. Rev. Lett. 86 (2001) 3352] to rationalize possible bifurcation of the Kirkendall plane inside a diffusion-grown compound layer is presented. A reaction couple, in which a single-phased layer of beta-NiAl intermetallic is growing during interdiffusion from its adjacent phases is used as a model system. The corresponding Kirkendall velocity diagram was constructed on the basis of inter- and intrinsic diffusion data obtained with the diffusion couple technique. The agreement between the predicted and experimentally determined position of the marker planes was found to be good within the range of uncertainty of the experimental results, which demonstrates the validity of the proposed model. It is observed that the position of a stable Kirkendall plane is characterized not only by the presence of inert markers, but also by a different crystal morphology at both sides of this plane. The bifurcation of the Kirkendall plane within the product layer of beta-NiAl is directly related to the growth of grains of this phase at a location in between (and not at) the interfaces with starting materials. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:4041 / 4048
页数:8
相关论文
共 50 条
  • [31] Activation volume for interdiffusion in B2 type intermetallic compounds NiAl and FeAl
    Nakamura, R
    Iijima, Y
    DIFFUSION IN MATERIALS: DIMAT 2004, PTS 1 AND 2, 2005, 237-240 : 364 - 369
  • [32] DEFORMATION PROPERTIES AND ELECTRON MICROSCOPY STUDIES OF INTERMETALLIC COMPOUND NIAL
    BALL, A
    SMALLMAN, RE
    ACTA METALLURGICA, 1966, 14 (10): : 1349 - &
  • [33] Quantitative convergent beam electron diffraction in the intermetallic compound NiAl
    Nuchter, W
    Weickenmeier, AL
    Mayer, J
    EUROPEAN JOURNAL OF CELL BIOLOGY, 1997, 74 : 46 - 46
  • [34] Monte Carlo Simulation of a Lattice Model for the Intermetallic Compound NiAl
    Zheng Hui
    Shen Liang
    Bai Bin
    ACTA PHYSICO-CHIMICA SINICA, 2009, 25 (12) : 2531 - 2536
  • [35] Strength and creep of structural materials based on intermetallic compound NiAl
    M. Yu. Belomyttsev
    A. I. Laptev
    I. P. Ezhov
    S. S. Chertov
    The Physics of Metals and Metallography, 2006, 101 : 397 - 403
  • [36] STRAIN-AGING EMBRITTLEMENT OF THE ORDERED INTERMETALLIC COMPOUND NIAL
    BRZESKI, JM
    HACK, JE
    DAROLIA, R
    FIELD, RD
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1993, 170 (1-2): : 11 - 18
  • [37] Competition between Kirkendall and Frenkel effects during multicomponent interdiffusion process
    Wierzba, Bartek
    PHYSICA A-STATISTICAL MECHANICS AND ITS APPLICATIONS, 2014, 403 : 29 - 34
  • [38] Kirkendall Effect During Grain Boundary Interdiffusion in Polycrystalline Thin Films
    Klinger, Leonid
    Rabkin, Eugen
    DIFFUSION IN MATERIALS - DIMAT 2011, 2012, 323-325 : 49 - 54
  • [39] Interdiffusion behavior between Nb and MoSi2 intermetallic compound
    Yao, Dengzun
    Yang, Junying
    Gong, Weiyan
    Zhou, Chungen
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (26): : 6787 - 6793
  • [40] Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu-Sn system
    Baheti, Varun A.
    Kashyap, Sanjay
    Kumar, Praveen
    Chattopadhyay, Kamanio
    Paul, Aloke
    ACTA MATERIALIA, 2017, 131 : 260 - 270