Failure diagnosis system design and data analysis based on infrared thermal image technology

被引:0
|
作者
Wu, GQ [1 ]
Chen, GS [1 ]
Wang, GF [1 ]
机构
[1] Ordnance Res Inst, Shijiazhuang, Peoples R China
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This thesis introduces in detail the function and system design of PCB failure diagnosis system, which is developed with the infrared thermal image technology, analyzes the infrared data of elements, and demonstrates a broad exploration on the obtained achievements and existing problems.
引用
收藏
页码:560 / 564
页数:5
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