Fabrication and characterization of microwave cured high-density polyethylene/carbon nanotube and polypropylene/carbon nanotube composites

被引:33
|
作者
Arora, Gaurav [1 ]
Pathak, Himanshu [1 ]
Zafar, Sunny [1 ]
机构
[1] Indian Inst Technol Mandi, Sch Engn, Composite Design & Mfg Lab, Mandi 175005, Himachal Prades, India
关键词
Microwave curing; carbon nanotube; polymer composites; thermal analysis; tensile strength; MECHANICAL-PROPERTIES; CARBON NANOTUBES; POLYMER; NANOCOMPOSITES;
D O I
10.1177/0021998318822705
中图分类号
TB33 [复合材料];
学科分类号
摘要
Carbon nanotubes have been used as reinforcements in polymers due to their high elasticity, flexibility, and thermal conductivity. In this study, pellets of high-density polyethylene +20 wt% carbon nanotube and polypropylene +20 wt% carbon nanotube were cured using microwave energy. X-ray diffraction, differential scanning calorimetry, thermogravimetric analysis, uniaxial tensile test, and scanning electron microscopy was used to study morphology, thermal stability, and mechanical performance of the microwave-cured composites. X-ray diffraction analysis confirmed the bonding between the polymer and carbon nanotube as the peaks shifted and intensified. From the thermal study, it was observed that melting point of the composites is affected by microwave curing and the crystallinity of high-density polyethylene/carbon nanotube and polypropylene/carbon nanotube changed by 57.67% and 47.28%, respectively. Results of the uniaxial tensile test indicated that Young's modulus of microwave cured high-density polyethylene/carbon nanotube and polypropylene/carbon nanotube composites were improved by 295% and 787.8%, respectively. Scanning electron microscopic fractography shows the stretching of polymer over-lapped on carbon nanotubes in the direction of the applied load.
引用
收藏
页码:2091 / 2104
页数:14
相关论文
共 50 条
  • [41] Polypropylene carbon nanotube composites by in situ polymerization
    Funck, Andreas
    Kaminsky, Walter
    COMPOSITES SCIENCE AND TECHNOLOGY, 2007, 67 (05) : 906 - 915
  • [42] FABRICATION AND CHARACTERIZATION OF MULTIWALL CARBON NANOTUBE POLYLACTIDE FIBER COMPOSITES
    Tong, Lemuel K. W.
    Rizvi, Reza
    Biddiss, Elaine
    Naguib, Hani E.
    PROCEEDINGS OF THE ASME CONFERENCE ON SMART MATERIALS, ADAPTIVE STRUCTURES AND INTELLIGENT SYSTEMS, 2010, VOL 2, 2010, : 129 - 135
  • [43] Fabrication and characterization of carbon nanotube reinforced magnesium matrix composites
    Mindivan, Harun
    Efe, Arife
    Kosatepe, A. Hadi
    Kayali, E. Sabri
    APPLIED SURFACE SCIENCE, 2014, 318 : 234 - 243
  • [44] Synthesis of high-density carbon nanotube films by microwave plasma chemical vapor deposition
    Kim, U
    Pcionek, R
    Aslam, DM
    Tománek, D
    DIAMOND AND RELATED MATERIALS, 2001, 10 (11) : 1947 - 1951
  • [45] Mechanical and thermal investigation of high-density polyethylene/multi-walled carbon nanotube/tungsten disulfide hybrid composites
    Sudarsanam, Sampath Kumar
    Panneerselvam, K.
    IRANIAN POLYMER JOURNAL, 2024, 33 (08) : 1075 - 1089
  • [46] Synthesis and characterization of novel low density polyethylene-multiwall carbon nanotube porous composites
    Rizvi, Reza
    Kim, Jae-Kyung
    Naguib, Hani
    SMART MATERIALS AND STRUCTURES, 2009, 18 (10)
  • [47] Fabrication and characterization of carbon nanotube triodes
    Hong, Wei-Kai
    Chen, Kuei-Hsien
    Chen, Li-Chyong
    Tarntair, Fu-Gow
    Chen, Kuo-Ji
    Lin, Jia-Bin
    Cheng, Huang-Chung
    2001, Japan Society of Applied Physics (40):
  • [48] Fabrication and characterization of carbon nanotube FETs
    Mizutani, T
    Ohno, Y
    QUANTUM SENSING AND NANOPHOTONIC DEVICES II, 2005, 5732 : 28 - 36
  • [49] Fabrication and characterization of carbon nanotube triodes
    Hong, WK
    Chen, KH
    Chen, LC
    Tarntair, FG
    Chen, KJ
    Lin, JB
    Cheng, HC
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (5A): : 3468 - 3473
  • [50] Fabrication and characterization of carbon nanotube interconnects
    Close, Gael F.
    Wong, H. -S. Philip
    2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, : 203 - +