Solution of emulsifiable oil and hydrogen peroxide for chemical-mechanical polishing of Ti alloy-A green approach

被引:17
|
作者
Kaushik, Roopesh M. [1 ]
Bhandakkar, Ajit B. [2 ]
Patro, T. Umasankar [1 ]
机构
[1] Def Inst Adv Technol, Dept Mat Engn, Pune 411025, Maharashtra, India
[2] Hindustan Aeronaut Ltd, Directorate Gen Aeronaut Qual Assurance, Ojhar 422207, Maharashtra, India
关键词
Metals and alloys; Surfaces; Mirror-finish; Polishing solution; Chemical-mechanical polishing; TITANIUM;
D O I
10.1016/j.matlet.2014.02.059
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A simple solution mixture comprising an emulsifiable oil and hydrogen peroxide was used for chemical-mechanical polishing (CMP) of Ti alloy with a composition of Ti-6.3Al-1.9V-2.9Zr-2.1 Mo. The solution was found to be an effective polishing agent resulting in mirror-finish of the alloy surface with a considerable reduction in average surface roughness (from Ra similar to 0.1 to 0.04 mu m) within 10 min of CMP. Further the root-mean-square roughness and arithmetic mean deviation of roughness of polished surface were found to be 1.12 nm and 0.96 nm, respectively. The chemical mixture used in the present study is greener and safer compared to the previously used chemicals for polishing of Ti alloys. Further the solution is devoid of any abrasive particles. On account of these advantages, the new polishing solution is expected to find use in mirror-polishing of Ti alloys for aerospace and biomedical applications. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:252 / 255
页数:4
相关论文
共 50 条
  • [21] The formation of Ti-polycide gate structure with high thermal stability using chemical-mechanical polishing (CMP) planarization technology
    Kim, HS
    Ko, DH
    Bae, DL
    Fujihara, K
    Kang, HK
    IEEE ELECTRON DEVICE LETTERS, 1999, 20 (02) : 86 - 88
  • [22] Silver Chemical Mechanical Polishing with the Synergy of Hydrogen Peroxide and 5-methyl-1H-benzotriazole
    Jiang, Liang
    Chen, Yu
    Zhang, Yongshun
    Chen, Yushan
    Lei, Rui
    Qian, Linmao
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2024, 13 (12)
  • [23] Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries
    R. Prasanna Venkatesh
    S. Ramanathan
    Journal of Applied Electrochemistry, 2010, 40 : 767 - 776
  • [24] Performance of Sodium Dodecyl Sulfate in Slurry with Glycine and Hydrogen Peroxide for Copper-Chemical Mechanical Polishing
    Pan, Yan
    Lu, Xinchun
    Pan, Guoshun
    Liu, Yuhong
    Luo, Jianbin
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (12) : II1082 - II1087
  • [25] Chemical Mechanical Polishing of Ge in Hydrogen Peroxide-Based Silica Slurries: Role of Ionic Strength
    Matovu, J. B.
    Penta, N. K.
    Peddeti, S.
    Babu, S. V.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (11) : H1152 - H1160
  • [26] Effect of Acidic Hydrogen Peroxide and Lysine Slurry on Ovonic Threshold Switch Film in Chemical Mechanical Polishing
    Li, Chenghsing
    Cai, Daolin
    Liu, Weili
    Fang, Wencheng
    Cui, Zijing
    Song, Zhitang
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2022, 11 (08)
  • [27] A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy
    Tsai, TH
    Wu, YF
    Yen, SC
    APPLIED SURFACE SCIENCE, 2003, 214 (1-4) : 120 - 135
  • [28] Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate
    Seo, YJ
    Kim, NH
    Lee, WS
    MATERIALS LETTERS, 2006, 60 (9-10) : 1192 - 1197
  • [29] A novel green chemical mechanical polishing for potassium dihydrogen phosphate using corn oil slurry
    Cui, X.
    Zhang, Z.
    Shi, C.
    Meng, F.
    Xu, G.
    Xie, W.
    Liu, Z.
    Wang, J.
    Wen, W.
    MATERIALS TODAY SUSTAINABILITY, 2022, 20
  • [30] Chemical roles of peroxide-based alkaline slurries in chemical-mechanical polishing of Ta: investigation of surface reactions using time-resolved impedance spectroscopy
    Assiongbon, KA
    Emery, SB
    Pettit, CM
    Babu, SV
    Roy, D
    MATERIALS CHEMISTRY AND PHYSICS, 2004, 86 (2-3) : 347 - 357