Reliability evaluation of Gilbert cell mixer based on a hot-carrier stressed device degradation model

被引:2
|
作者
Lin, WC [1 ]
Du, LJ [1 ]
King, YC [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Elect Engn, STAR Grp, Microelect Lab, Hsinchu 300, Taiwan
关键词
D O I
10.1109/RFIC.2004.1320630
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A comprehensive device degradation model is built for circuit-level reliability evaluation. A sub-circuit model describing the device degradation under hot-carrier stress is proposed. Combining with the original model predicting device characteristics change under FN stressing in our previous work, a complete device degradation model is presented with fairly good agreements with both DC and AC characteristics. Reliability of mixed-mode Gilbert Cell mixer is investigated and analyzed as well.
引用
收藏
页码:387 / 390
页数:4
相关论文
共 50 条
  • [21] Investigation of Hot-Carrier Degradation in 0.18-μm MOSFETs for the Evaluation of Device Lifetime and Digital Circuit Performance
    Gupta, Anshul
    Gupta, Charu
    Jatana, H. S.
    Dixit, Abhisek
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2019, 19 (04) : 609 - 614
  • [22] A MODEL FOR AC HOT-CARRIER DEGRADATION IN N-CHANNEL MOSFETS
    MISTRY, K
    DOYLE, B
    IEEE ELECTRON DEVICE LETTERS, 1991, 12 (09) : 492 - 494
  • [23] Analytical modeling of hot-carrier induced degradation of MOS transistor for analog design for reliability
    Dubois, Benoit
    Kammerer, Jean-Baptiste
    Hebrard, Luc
    Braun, Francis
    ISQED 2007: PROCEEDINGS OF THE EIGHTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, 2007, : 53 - +
  • [24] Impacts of SiN-capping layer on the device characteristics and hot-carrier degradation of nMOSFETs
    Lu, Chia-Yu
    Lin, Horng-Chih
    Lee, Yao-Jen
    Shie, Yu-Lin
    Chao, Chih-Cheng
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2007, 7 (01) : 175 - 180
  • [25] DYNAMIC DEVICE DEGRADATION DURING HOT-CARRIER STRESS IN DDD N-MOSFETS
    CHEN, SL
    GONG, J
    YANG, SH
    SOLID-STATE ELECTRONICS, 1993, 36 (04) : 501 - 511
  • [26] New understanding of LDD CMOS hot-carrier degradation and device lifetime at cryogenic temperatures
    WangRatkovic, J
    Lacoe, RC
    MacWilliams, KP
    Song, M
    Brown, S
    Yabiku, G
    1997 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 35TH ANNUAL, 1997, : 312 - 319
  • [27] New understanding of LDD NMOS hot-carrier degradation and device lifetime at cryogenic temperatures
    WangRatkovic, J
    Lacoe, RC
    Macwilliams, KP
    Song, MY
    Brown, S
    Yabiku, G
    MICROELECTRONICS AND RELIABILITY, 1997, 37 (10-11): : 1747 - 1754
  • [28] Distribution Function Based Simulations of Hot-Carrier Degradation in Nanowire FETs
    Vandemaele, Michiel
    Kaczer, Ben
    Stanojevic, Zlatan
    Tyaginov, Stanislav
    Makarov, Alexander
    Chasin, Adrian
    Mertens, Hans
    Linten, Dimitri
    Groeseneken, Guido
    2018 INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2018, : 21 - 24
  • [29] Hot-carrier degradation mechanism and promising device design of nMOSFETs with nitride sidewall spacer
    Sambonsugi, Y
    Sugii, T
    1998 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 36TH ANNUAL, 1998, : 184 - 188
  • [30] Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation
    Tallarico, Andrea Natale
    Reggiani, Susanna
    Depetro, Riccardo
    Manzini, Stefano
    Torti, Andrea Mario
    Croce, Giuseppe
    Sangiorgi, Enrico
    Fiegna, Claudio
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (11) : 5195 - 5198