Foreword - Contributions from the ITherm'98 to thermal management

被引：19

作者：

Lee, TYT ^{[1
]}

Ramakrishna, K

Amon, CK

机构：

[1] Motorola Inc, Tempe, AZ 85284 USA

[2] Motorola Inc, Computat Technol Lab, Austin, TX 78721 USA

[3] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2000年 / 23卷 / 01期

关键词：

D O I：

10.1109/TCAPT.2000.833035

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：3 / 5

页数：3

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