Foreword - Contributions from the ITherm'98 to thermal management

被引：19
|
作者：
Lee, TYT [1 ]
Ramakrishna, K
Amon, CK
机构：
[1] Motorola Inc, Tempe, AZ 85284 USA
[2] Motorola Inc, Computat Technol Lab, Austin, TX 78721 USA
[3] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2000年 / 23卷 / 01期
关键词：
D O I：
10.1109/TCAPT.2000.833035
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：3 / 5
页数：3
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