Reduction of surface scattering loss in polymer microrings using thermal-reflow technique

被引：42

作者：

Chao, CY ^{[1
]}

Guo, LJ ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Solid State Elect Lab, Ann Arbor, MI 48109 USA

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 2004年 / 16卷 / 06期

基金：

美国国家科学基金会;

关键词：

microresonator; microring; polymer waveguide; surface tension; thermal effect;

D O I：

10.1109/LPT.2004.827413

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A thermal-reflow technique is used to greatly reduce surface roughness scattering loss in polymer microring devices. Smoother surfaces were achieved and verified by scanning electron microscopy. Reduction in surface roughness scattering was further supported by the loss measurement of both straight waveguides and microring resonators. The variance of surface roughness in a polymer microring device is estimated to decrease by 35-40 nm after the thermal-reflow treatment, corresponding to a loss reduction of similar to74 dB/cm.

引用

页码：1498 / 1500

页数：3

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