Microstructure and mechanical properties of bulk nanostructured Cu-Ta alloys consolidated by equal channel angular extrusion

被引:110
|
作者
Darling, K. A. [1 ]
Tschopp, M. A. [1 ]
Guduru, R. K. [2 ]
Yin, W. H. [3 ]
Wei, Q. [3 ]
Kecskes, L. J. [1 ]
机构
[1] US Army Res Lab, Weap & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
[2] Univ Michigan, Dept Mech Engn, Dearborn, MI 48128 USA
[3] Univ N Carolina, Dept Mech Engn & Engn Sci, Charlotte, NC 28223 USA
关键词
Nanocrystalline alloys; Cu-Ta alloys; Equal channel angular pressing; Mechanical behavior; Dynamic compression test; STRAIN-RATE SENSITIVITY; SHEAR PUNCH TEST; NANOCRYSTALLINE COPPER; GRAIN-SIZE; PLASTIC-DEFORMATION; THERMAL-STABILITY; ACTIVATION VOLUME; TENSILE BEHAVIOR; ULTRAFINE GRAIN; METALS;
D O I
10.1016/j.actamat.2014.04.074
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Nanostructured Cu-Ta alloys have shown promise as high-strength nanocrystalline materials in part due to their limited grain growth at high temperatures. In the present study, Cu-Ta alloy powders, synthesized via high-energy cryogenic mechanical alloying, were consolidated into bulk nanostructured specimens using equal channel angular extrusion (ECAE) at high temperatures. Subsequent microstructure characterization indicated full consolidation, which resulted in an equiaxed grain structure for the Cu matrix along with the formation of fine Ta precipitates, the size distributions of which varied both with composition and processing temperature. Microhardness, compression and shear punch testing indicated, in some cases, an almost threefold increase in mechanical properties above that predicted by Hall-Petch estimates for pure nanocrystalline Cu. Stress relaxation tests substantiated the strain-hardening behavior and grain-size-dependent dislocation activity observed in the nanocrystalline Cu-Ta samples. Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
引用
收藏
页码:168 / 185
页数:18
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