Investigation of Pilling Strength and Bus Bar Surface Roughness for Solar Cell Soldering

被引：0

作者：

Chung, Wen-Tai ^{[1
]}

Wu, Yi-Te ^{[1
]}

Chen, Chien-Wen ^{[1
]}

Wang, Po-Wen ^{[1
]}

Lin, Meng-Lin ^{[1
]}

Lin, Tsai-Yuan ^{[1
]}

Wu, Chih-Hsyong ^{[1
]}

机构：

[1] Motech Ind Inc, Tainan, Taiwan

来源：

2013 IEEE 39TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC) | 2013年

关键词：

Pilling strength; Solar cell; Bus bar; Ribbon; Silicon;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

In the present, the soldering is the major method to connect the silicon crystalline solar cell and module in the industry. Cu-ribbon is the main interconnector to string solar cells and conducts the electricity from solar cells to the solar cell module. The pilling strength between solar cells and Cu-ribbons is an important factor to soldering process reliability and efficiency. The paper reveals the pilling strength is relative to the surface roughness of the bus bar on the silicon solar cell. Rougher surface on the bus bar has the stronger pilling strength in this study..

引用

页码：2992 / +

页数：2

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