Si/SiGe n-MODFETs on thin SiGe virtual substrates prepared by means of He implantation

被引:14
|
作者
Herzog, HJ [1 ]
Hackbarth, T
Seiler, U
König, U
Luysberg, M
Holländer, B
Mantl, S
机构
[1] DaimlerChrysler AG, Res & Technol, D-89081 Ulm, Germany
[2] Inst Festkorperforsch, D-52425 Julich, Germany
[3] Inst Schichten & Grenzflachen, D-52425 Julich, Germany
关键词
He implantation; n-MODFET; SiGe heterostructure; SiGe virtual substrate; strained Si;
D O I
10.1109/LED.2002.801336
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Si/SiGe n-type modulation-doped field-effect transistors grown on a very thin strain-relieved Si0.69Ge0.31 buffer on top of a Si(100) substrate were fabricated and characterized. This novel type of virtual substrate has been created by means of a high dose-He ion implantation localized beneath a 95-nm-thick pseudomorphic SiGe layer on Si followed by a strain relaxing annealing step at 850 degreesC. The layers were grown by molecular beam epitaxy. Electron mobilities of 1415 cm(2)/Vs and 5270 cm(2)/Vs were measured at room temperature and 77 K, respectively, at a sheet carrier density of about 3 X 10(12)/cm(2). The fabricated transistors with Pt-Schottky gates showed good dc characteristics with a drain current of 330 mA/mm and a transconductance of 200 mS/mm. Cutoff frequencies of f(t) = 49 GHz and f(max) = 95 GHz at 100 nm gate length were obtained which are quite close to the figures of merit of a control sample grown on a conventional, thick Si0.7Ge0.3 buffer.
引用
收藏
页码:485 / 487
页数:3
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