Si/SiGe n-MODFETs on thin SiGe virtual substrates prepared by means of He implantation

被引:14
|
作者
Herzog, HJ [1 ]
Hackbarth, T
Seiler, U
König, U
Luysberg, M
Holländer, B
Mantl, S
机构
[1] DaimlerChrysler AG, Res & Technol, D-89081 Ulm, Germany
[2] Inst Festkorperforsch, D-52425 Julich, Germany
[3] Inst Schichten & Grenzflachen, D-52425 Julich, Germany
关键词
He implantation; n-MODFET; SiGe heterostructure; SiGe virtual substrate; strained Si;
D O I
10.1109/LED.2002.801336
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Si/SiGe n-type modulation-doped field-effect transistors grown on a very thin strain-relieved Si0.69Ge0.31 buffer on top of a Si(100) substrate were fabricated and characterized. This novel type of virtual substrate has been created by means of a high dose-He ion implantation localized beneath a 95-nm-thick pseudomorphic SiGe layer on Si followed by a strain relaxing annealing step at 850 degreesC. The layers were grown by molecular beam epitaxy. Electron mobilities of 1415 cm(2)/Vs and 5270 cm(2)/Vs were measured at room temperature and 77 K, respectively, at a sheet carrier density of about 3 X 10(12)/cm(2). The fabricated transistors with Pt-Schottky gates showed good dc characteristics with a drain current of 330 mA/mm and a transconductance of 200 mS/mm. Cutoff frequencies of f(t) = 49 GHz and f(max) = 95 GHz at 100 nm gate length were obtained which are quite close to the figures of merit of a control sample grown on a conventional, thick Si0.7Ge0.3 buffer.
引用
收藏
页码:485 / 487
页数:3
相关论文
共 50 条
  • [1] The radiation tolerance of strained Si/SiGe n-MODFETs
    Madan, Anuj
    Jun, Bongim
    Diestelhorst, Ryan M.
    Appaswamy, Aravind
    Cressler, John D.
    Schrimpf, Ronald D.
    Fleetwood, Daniel M.
    Marshall, Paul W.
    Isaacs-Smith, Tamara
    Williams, John R.
    Koester, Steven J.
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2007, 54 (06) : 2251 - 2256
  • [2] Noise behavior of SiGe n-MODFETS
    Rennane, A
    Bary, L
    Cibiel, G
    Llopis, O
    Hackbarth, T
    Graffeuil, J
    Plana, R
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2005, 8 (1-3) : 383 - 388
  • [3] Formation of thin SiGe virtual substrates by ion implantation into Si substrates
    Sawano, K
    Koh, S
    Hirose, Y
    Hattori, T
    Nakagawa, K
    Shiraki, Y
    APPLIED SURFACE SCIENCE, 2004, 224 (1-4) : 99 - 103
  • [4] Monte Carlo simulations of SiGe n-MODFETs with high tensile strained Si channels
    Crow, GC
    Abram, RA
    Yangthaisong, A
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2000, 15 (07) : 770 - 775
  • [5] High frequency n-type MODFETs on ultra-thin virtual SiGe substrates
    Hackbarth, T
    Herzog, HJ
    Rinaldi, F
    Soares, T
    Holländer, B
    Mantl, S
    Luysberg, M
    Fichtner, PFP
    SOLID-STATE ELECTRONICS, 2003, 47 (07) : 1179 - 1182
  • [6] High-fT n-MODFETs fabricated on Si/SiGe heterostructures grown by UHV-CVD
    Koester, SJ
    Chu, JO
    Groves, RA
    ELECTRONICS LETTERS, 1999, 35 (01) : 86 - 87
  • [7] Low-frequency noise in buried-channel SiGe n-MODFETs
    Madan, Anuj
    Cressler, John D.
    Koester, Steven J.
    SOLID-STATE ELECTRONICS, 2009, 53 (08) : 901 - 904
  • [8] Relaxation enhancement of SiGe thin layers by ion implantation into Si substrates
    Sawano, K
    Hirose, Y
    Koh, S
    Nakagawa, K
    Hattori, T
    Shiraki, Y
    JOURNAL OF CRYSTAL GROWTH, 2003, 251 (1-4) : 685 - 688
  • [9] Design and fabrication of Si/SiGe n-type MODFETs
    Gluck, M
    Hackbarth, T
    Birk, M
    Haas, A
    Kohn, E
    Konig, U
    PHYSICA E, 1998, 2 (1-4): : 763 - 767
  • [10] Improved DC and RF performance in Si/SiGe n-MODFETs with ion-implanted buried p-well doping
    Koester, SJ
    Saenger, KL
    Chu, JO
    Ouyang, QC
    Ott, JA
    Canaperi, DF
    Tornello, JA
    Jahnes, CV
    IEEE ELECTRON DEVICE LETTERS, 2005, 26 (11) : 817 - 819