Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurements

被引：0
|
作者：
Xu, Gaowei [1 ]
Gai, Wei [1 ]
Luo, Le [1 ]
Zhang, Shulin [2 ]
Xie, Xiaoming [2 ]
机构：
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China
[2] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai, Peoples R China
来源：
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年
基金：
中国国家自然科学基金;
关键词：
Package of SQUID; Planar SQUID gradiometer; Warpage; Modal analysis; Unbalance; Mobile noise; WARPAGE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The warpage, vibration mode, frequency response characteristics and their impact on mobile noise of planar SQUID (Superconducting quantum interference device) gradiometer were studied and evaluated by using mechanical simulation and experiment methods. Firstly, ANSYS static mechanical method was used to simulate the stress and deformation of SQUID with various adhesive bonding methods. The correlation between warpage and unbalance was also set up. On this basis, modal analysis method was used to study the vibration modes and frequency response characteristic as well as their dynamic effect on unbalance of gradiometer. Secondly, by means of magnetic measurement the static unbalance as well as response of the planar SQUID gradiometer with various packaging parameters were performed. Compared the simulation results with the experiment, warpage and its impact on unbalance of planar SQUID gradiometer were validated.
引用
收藏
页码：1529 / 1532
页数：4
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