End-fire Antenna-in-package Solution for Millimeter-wave Applications in a Teflon-based PCB Technology

被引：0
|
作者：
Enayati, Amin [1 ]
De Raedt, Walter [1 ]
Ocket, Ilja [2 ]
Vandenbosch, Guy A. E. [2 ]
机构：
[1] Interuniv Microelect Ctr IMEC, RF Component Design & Modeling Grp, Louvain, Belgium
[2] KU Leuven Univ, TELEMIC Grp, Leuven, Belgium
来源：
2013 EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2013年
关键词：
Antenna-in-package; multilayer PCB; antipodal Vivaldi antenna; millimeter-wave communications;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An antenna-in-package solution for millimeter-wave applications has been introduced. The antenna which has an antipodal Vivaldi architecture has been implemented in a multilayer Teflon-based PCB technology. This technology not only helps to reduce the interconnect losses but because of its multilayer stack also allows for promising integration ideas. The antenna which has an end-fire radiating pattern has been measured for its electrical performance such as gain and return loss. Its return loss is better than 10 dB from 40 GHz to 90 GHz. Also it shows gain values of about 4.5 dB with a deviation of less than 1 dB from 57 GHz to 66 GHz which makes it a promising choice for 60-GHz communication systems.
引用
收藏
页码：48 / 51
页数：4
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