Wafer level micropackaging for RIF MEMS switches

被引：0
|
作者：
Forehand, David I. [1 ]
Goldsmith, Charles L. [1 ]
机构：
[1] MEMtronics Corp, Plano, TX 75075 USA
来源：
Advances in Electronic Packaging 2005, Pts A-C | 2005年
关键词：
RF MEMS; low loss; packaging; wafer-level; hermeticity; humiticity;
D O I：
10.1115/IPACK2005-73398
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB pack-age added insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.
引用
收藏
页码：2047 / 2051
页数：5
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