Bond formation and fiber embedment during ultrasonic consolidation

被引：93
|
作者：
Yang, Y. [1 ]
Ram, G. D. Janaki [1 ]
Stucker, B. E. [1 ]
机构：
[1] Utah State Univ, Dept Mech & Aerosp Engn, Logan, UT 84322 USA
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2009年 / 209卷 / 10期
基金：
美国国家科学基金会;
关键词：
Additive manufacturing; Ultrasonic consolidation; Ultrasonic metal welding; Interfacial microstructures; Bonding mechanism; Fiber embedment; Metal matrix composites; PARAMETERS;
D O I：
10.1016/j.jmatprotec.2009.01.014
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The quality of ultrasonically consolidated parts critically depends on the bond quality between individual metal foils. This necessitates a detailed understanding of interface microstructures and ultrasonic bond formation mechanisms. In this work, the interface microstructures of a variety of ultrasonically consolidated similar and dissimilar metal samples were investigated. Samples with embedded SiC fibers were also investigated. Based on detailed microstructural studies, the mechanisms of foil bonding and fiber embedment in ultrasonic consolidation have been discussed. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：4915 / 4924
页数：10
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