The effects of adhesive strength and load on material transfer in nanoscale wear

被引：20

作者：

Hu, Xiaoli ^{[1
]}

Sundararajan, Sriram ^{[2
]}

Martini, Ashlie ^{[1
]}

机构：

[1] Univ Calif Merced, Sch Engn, Merced, CA 95343 USA

[2] Iowa State Univ, Dept Mech Engn, Ames, IA 50011 USA

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2014年 / 95卷

关键词：

Nanoscale wear; Work of adhesion; Molecular dynamics; MOLECULAR-DYNAMICS SIMULATION; FORCE MICROSCOPE TIP; SOFT WORKPIECE; HARD TOOL; MECHANISMS; COPPER; NANOTRIBOLOGY; ROUGHNESS; DIFFUSION; SILICON;

D O I：

10.1016/j.commatsci.2014.08.014

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Molecular dynamics simulation is used to study the effects of adhesive strength and load on material transfer during wear of nanoscale sliding contacts. Material transfer is quantified in terms of the number of atoms transferred from a copper substrate to a silicon dioxide tip where the interaction strength between the two materials is varied to modulate the work of adhesion. Material transfer is quantified before and after sliding, providing a means of isolating adhesive and abrasive wear mechanisms. Results reveal that both adhesion and abrasion contribute to material transfer during sliding, but that their relative contributions depend on the applied load and adhesive strength. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：464 / 469

页数：6

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