Determination of Mechanical Properties of Active Solder Alloys using the Measuring Method "Small Punch Test"

被引：0

作者：

Kolenak, Roman ^{[1
]}

Martinkovic, Maros ^{[1
]}

机构：

[1] Slovak Univ Technol Bratislava, Fac Mat Sci & Technol Trnava, Trnava 91724, Slovakia

来源：

LOCAL MECHANICAL PROPERTIES IX | 2014年 / 586卷

关键词：

active solder; mechanical properties; small punch test;

D O I：

10.4028/www.scientific.net/KEM.586.174

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The paper deals with determination of mechanical properties of active solders type Sn3.5Ag4Ti(Ce,Ga), Sn2Ti, Bi25In18Sn and Sn2La by use of "Small Punch Test" (SPT). Reference curves were plotted for determination of mechanical properties of the mentioned solders, which allowed mutual comparison of measured results from SPT test with the results obtained from standard tests. Results of study suggest that SPT method can be used for testing mechanical properties of active solders with special composition, manufactured by special procedures. The proposed measurement method allows to attain a desired values of mechanical properties even in the case if standard measurement methods cannot be used.

引用

页码：174 / 177

页数：4

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