Destructive and non-destructive evaluation of cu/cu diffusion bonding with interlayer aluminum

被引：2
|
作者：
Kumar, Santosh A. [1 ]
Mohan, T. [1 ]
Kumar, Suresh S. [1 ]
Ravisankar, B. [1 ]
机构：
[1] Natl Inst Technol, Dept Met & Mat Engn, Tiruchirappalli 620015, Tamil Nadu, India
来源：
INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN MATERIALS, MECHANICAL AND CIVIL ENGINEERING | 2018年 / 330卷
关键词：
COPPER;
D O I：
10.1088/1757-899X/330/1/012045
中图分类号：
TU [建筑科学];
学科分类号：
0813 ;
摘要：
The current study is established an inspection procedure for assessing quality of diffusion bonded joints using destructive and non-destructive method. Diffusion bonding of commercially pure copper with aluminium interlayer was carried out uniaxial load at 15 MPa for different temperatures under holding time 60 min in vacuum atmosphere. The bond qualities were determined by destructive and non-destructive testing method (ultrasonic C-scan). The bond interface and bonded samples were analysed using optical and scanning electron microscopy (SEM). The element composition of the fractured and bonded area is determined using the Energy Dispersive Spectrometry (EDS). The bond quality obtained by both testing methods and its parameters are correlated. The optimized bonding parameter for best bonding characteristics for copper diffusion bonding with aluminum interlayer is reported.
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页数：6
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