Modelling and simulation thermal expansion phenomena in MEMS gyroscope

MEMS vibrating gyroscopes are small devices (in microscale) measuring rotational velocity. Because this kind of device is mechanical, it includes some springs and anchors, movable and static parts; thus it is obvious that under some kind of force, its parts can deform. The problem is significantly related to materials those MEMS are built of. We have to notice that material such polysilicon, popular in MEMS world, is thermo-sensitive -it means, its properties related to its structure and dynamic behaviour change along with temperature. The main objective of this paper is to present complex model in Matlab/SIMULINK which takes into consideration temperature as one of the main factor influences on MEMS Gyroscope operation. It will help to analyse impact of temperature variation on size of the structure as well particular parts, elastic modulus of the polysilicon (material, MEMS gyroscope is built of), and some important output parameters like quality factor (Q factor) and eigenfrequency which determines behaviour of such small device and are crucial for electronic processing integrated circuit (ASIC) design.