Copper: Emerging material for wire bond assembly

被引：0
|
作者：
Ellis, TW [1 ]
Levine, L [1 ]
Wicen, R [1 ]
机构：
[1] Kulicke & Soffa Ind, K&S Adv Bonding Syst, Willow Grove, PA 19090 USA
来源：
SOLID STATE TECHNOLOGY | 2000年 / 43卷 / 04期
关键词：
Aluminum - Copper - Cost benefit analysis - Electromigration - Finite element method - Integrated circuit manufacture - Metallizing - Oxidation - Shear strength - Surface treatment;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Copper is being re-evaluated as material for wire bonding because of the emergence current status of copper wire bonding, including for special processes to address the challenges created by the new systems.
引用
收藏
页码：71 / +
页数：4
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