2D and 3D heterogeneous photonic integrated circuits

被引：2
|
作者：
Ben Yoo, S. J. [1 ]
机构：
[1] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
来源：
SMART PHOTONIC AND OPTOELECTRONIC INTEGRATED CIRCUITS XVI | 2014年 / 8989卷
关键词：
3D integration; photonic integration; laser inscription; ULTRAFAST-LASER INSCRIPTION; LOSS WAVE-GUIDES; FEMTOSECOND LASER; INTERCONNECTION;
D O I：
10.1117/12.2047502
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances in photonic integration demands an addition of a new dimension in integration. 3D integration emerges as a new necessity in providing functional integrated microsystems for modern computing, networking, and imaging applications.
引用
收藏
页数：9
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