共 50 条
- [32] Preparation for intermetallic powders of Cu-Sn and Cu-Ni-Sn systems via solid-liquid reaction milling technique TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2007, 17 : S594 - S598
- [36] Effect of sizes and sampling conditions on results of chemical analysis of Cu-Sn and Cu-Sn-Pb alloys Metalloved Term Obrab Met, 10 (34-35):
- [37] THERMODYNAMIC FACTOR AND VACANCY FLOW TERM FOR INTERDIFFUSION IN COPPER-RICH CU-ZN, CU-IN AND CU-SN ALLOYS TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1984, 25 (04): : 226 - 233
- [38] Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding Journal of Electronic Materials, 2012, 41 : 2453 - 2462
- [39] Void Formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding 2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2015,