Modeling and fabrication of thin film thermopile sensor

被引:7
|
作者
Kim, Jung-Kyun [1 ]
Kim, Tae-Hwa [1 ]
Cho, Sung-Cheon [1 ]
Shin, Sang-Mo [1 ]
Lee, Sun-Kyu [1 ]
机构
[1] GIST, Kwangju 500712, South Korea
来源
关键词
aluminium; Butterworth filters; CMOS integrated circuits; elemental semiconductors; heat transfer; low noise amplifiers; microsensors; preamplifiers; semiconductor junctions; silicon; thermopiles; thin film sensors; HEAT-FLUX SENSOR;
D O I
10.1116/1.3046152
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A thin film micro heat-flux sensor using thermopile, which can measure the heat flow, was fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a ten-junction polysilicon and aluminum thermoelectric sensor with an ultralow noise preamplifier and low pass Butterworth filter has enabled the resolution of 3.4 mu W power and shows the sensitivity of 2.43 mV/mu W. In order to estimate the heat generation of samples from the output measurement of a micro heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in a micro heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph methodology. The electro-thermal system model, where the thermal domain and the electrical domain are coupled, expresses the behavior that the heat generation of samples converts thermal input to electrical output through the system model. The proposed electro-thermal system model shows good agreement with measured voltage responses.
引用
收藏
页码:1466 / 1472
页数:7
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