Experimental Study on the Effect of Reflow Soldering Temperature Profile on the Solder Joint Shape

被引：0
|
作者：
Wang, Bo [1 ,2 ]
Yang, Xuexia [1 ]
Zhang, Yu [3 ]
Shu, Xuefeng [1 ]
机构：
[1] Taiyuan Univ Technol, Inst Appl Mech & Biomed Engn, 79 West Yingze St, Taiyuan 030024, Shanxi, Peoples R China
[2] Taiyuan Inst Technol, Dept Basic Sci, Taiyuan 030008, Shanxi, Peoples R China
[3] Northeastern Univ, Sch Mech Engn & Automat, Shenyang 110004, Peoples R China
来源：
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, Surface mount experiment of Sn-Pb and Lead-Free solder joints under different thermal reflow profile was aimed at statistical analysis of the reflowed cross-section contour and shape parameters (height, diameter and contact angle). The results as follows: Reflowed solder joints was a pot-shaped body which the top pad is slightly smaller than the bottom pad, and the maximum diameter of solder joints in the side was under the central position; Solder joint shapes obtained from different thermal reflow profiles have greatly differences; The smaller heating factors, the higher height and the smaller diameter and contact angle of solder joint formed by welding.
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页码：1128 / 1131
页数：4
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