Experimental and theoretical analysis of factors causing asymmetrical temperature dependence of Vt in High-k Metal gate CMOS with capped High-k techniques

被引:0
|
作者
Iijima, Ryosuke [1 ]
Takayanagi, Mariko [1 ]
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Toshiba Amer Elect Components Inc, Yorktown Hts, NY 10598 USA
来源
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST | 2008年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Temperature (T) dependence of threshold voltage (V-t) for High-k Metal gate stack (HK/MG) CMOS is investigated thoroughly. It is found, for the first time, that T dependence of V-t (dV(t)/dT) for HK/MG CMOS shows asymmetrical behavior between N and PFETs unlike conventional Poly-Si/SiON CMOS. Moreover, this dV(t)/dT asymmetry is observed even if capping techniques for V-t tuning are applied to High-k dielectrics. The position of effective Fermi level in HK/MG (E-FM,E-eff) is determined quantitatively in a wide range of T by experimental and theoretical analysis for the first time, which reveals that the off-center arrangement of E-FM,E-eff in Si band gap is the cause of dV(t)/dT asymmetry not only in the long channel region but also in the short channel region. In addition, based on these analyses, dV(t)/dT for aggressively thinned FinFETs with HK/MG is predicted.
引用
收藏
页码:581 / 584
页数:4
相关论文
共 50 条
  • [1] High performance FDSOI CMOS technology with metal gate and high-k
    Doris, B. (dorisb@us.ibm.com), 2005, (Institute of Electrical and Electronics Engineers Inc.):
  • [2] High performance FDSOI CMOS technology with metal gate and high-k
    Doris, B
    Kim, YH
    Linder, BP
    Steen, M
    Narayanan, V
    Boyd, D
    Rubino, J
    Chang, L
    Sleight, J
    Topol, A
    Sikorski, E
    Shi, L
    Wong, K
    Babich, K
    Zhang, Y
    Kirsch, P
    Newbury, J
    Walker, GF
    Carruthers, R
    D'Emic, C
    Kozlowski, P
    Jammy, R
    Guarini, KW
    Leong, M
    2005 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2005, : 214 - 215
  • [3] Integration of high-k/metal gate stacks for CMOS application
    Chen, D. Y.
    Lin, C. T.
    Hsu, Y. R.
    Chang, C. H.
    Wang, H. Y.
    Chiu, Y. S.
    Yu, C. H.
    2008 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PROGRAM, 2008, : 148 - 149
  • [4] Theoretical analysis of high-k dielectric gate stacks
    Demkov, A. A.
    Sharia, O.
    Lee, J. K.
    MICROELECTRONIC ENGINEERING, 2007, 84 (9-10) : 2032 - 2034
  • [5] Integration issues of high-k and metal gate into conventional CMOS technology
    Song, SC
    Zhang, Z
    Huffman, C
    Bae, SH
    Sim, JH
    Kirsch, P
    Majhi, P
    Moumen, N
    Lee, BH
    THIN SOLID FILMS, 2006, 504 (1-2) : 170 - 173
  • [6] Compatibility of dual metal gate electrodes with high-K dielectrics for CMOS
    Lee, J
    Suh, YS
    Lazar, H
    Jha, R
    Gurganus, J
    Lin, YX
    Misra, V
    2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, 2003, : 323 - 326
  • [7] Dual work function high-k/metal gate CMOS FinFETs
    Hussain, Muhammad Mustafa
    Smith, Casey
    Kalra, Pankaj
    Yang, Ji-Woon
    Gebara, Gabe
    Sassman, Barry
    Kirsch, Paul
    Majhi, Prashant
    Song, Seung-Chul
    Harris, Rusty
    Tseng, Hsing -Huang
    Jammy, Raj
    ESSDERC 2007: PROCEEDINGS OF THE 37TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2007, : 207 - +
  • [8] High-k gate dielectrics for scaled CMOS technology
    Ma, TP
    SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 297 - 302
  • [9] CMOS integration issues with high-k gate stack
    Kwong, DL
    IPFA 2004: PROCEEDINGS OF THE 11TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2004, : 17 - 20
  • [10] Frequency Dependence of NBTI in High-k/Metal-gate Technology
    Hsieh, M. -H.
    Maji, D.
    Huang, Y. -C.
    Yew, T. -Y.
    Wang, W.
    Lee, Y. -H.
    Shih, J. R.
    Wu, K.
    2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,