共 50 条
- [41] Etching Si wafer using atmospheric pressure RF cold plasma jet Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2007, 28 (10): : 1615 - 1619
- [44] Influence of processing parameters on atmospheric pressure plasma etching of polyvinyl alcohol films MATERIALS AND MANUFACTURING, PTS 1 AND 2, 2011, 299-300 : 608 - +
- [45] Cutting of SiC Wafer by Atmospheric-Pressure Plasma Etching with Wire Electrode SILICON CARBIDE AND RELATED MATERIALS 2011, PTS 1 AND 2, 2012, 717-720 : 865 - +