Ultra low-k dielectric materials for high performance interconnects.

被引：0
|
作者：
Hedrick, JC [1 ]
Tyberg, CS [1 ]
Huang, E [1 ]
Sankarapandian, M [1 ]
Ryan, JG [1 ]
机构：
[1] IBM Corp, Thomas J Watson Res Ctr, Dielect & Exploratory Mat, Yorktown Hts, NY 10598 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2002年 / 223卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
400-POLY
引用
收藏
页码：D43 / D43
页数：1
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