A Fast Ultrasonic Simulation Tool based on Massively Parallel Implementations

被引：0

作者：

Lambert, Jason ^{[1
]}

Rougeron, Gilles ^{[1
]}

Lacassagne, Lionel ^{[2
]}

Chatillon, Sylvain ^{[1
]}

机构：

[1] CEA, LIST, F-91191 Gif Sur Yvette, France

[2] Univ Paris 11, LRI, F-91405 Orsay, France

来源：

40TH ANNUAL REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: INCORPORATING THE 10TH INTERNATIONAL CONFERENCE ON BARKHAUSEN NOISE AND MICROMAGNETIC TESTING, VOLS 33A & 33B | 2014年 / 1581卷

关键词：

Ultrasonic Inspection Simulation; Graphical Processing Units; Pencil Method; Kirchhoff Model; PROPAGATION;

D O I：

10.1063/14865069

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This paper presents a CIVA optimized ultrasonic inspection simulation tool, which takes benefit 01 the power of massively parallel architectures : graphical processing units (GPU) and multi-core general purpose processors (GPP). This tool is based on the classical approach used in CIVA : the interaction model is based on Kirchoff, and the ultrasonic field around the defect is computed by the pencil method. The model has been adapted and parallelized for both architectures. At this stage, the configurations addressed by the tool are : multi and mono-element probes. planar specimens made of simple isotropic materials, planar rectangular defects or side drilled holes of small diameter. Validations on the model accuracy and performances measurements are presented.

引用

页码：1999 / 2006

页数：8

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