共 50 条
- [42] An On-chip 28/39 GHz Millimeter-wave Diplexer For 5G Dual-band Front End Modules 2024 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM, IWS 2024, 2024,
- [43] Broadband Smart mmWave Front-End-Modules in Advanced FD-SOI with Adaptive-Biasing and Tuning of Distributed Antenna-Arrays PROCEEDINGS OF THE 2020 IEEE TEXAS SYMPOSIUM ON WIRELESS AND MICROWAVE CIRCUITS AND SYSTEMS (WMCS), 2020,
- [44] A Coupled-RTWO-Based Subharmonic Receiver Front-End for 5G E-Band Backhaul Links in 28nm Bulk CMOS 2018 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE - (ISSCC), 2018, : 412 - +
- [45] 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules IEICE TRANSACTIONS ON ELECTRONICS, 2012, E95C (07): : 1276 - 1284
- [46] Highly-Integrated Scalable D-band Receiver Front-End Modules in a 130 nm SiGe Technology for Imaging and Radar Applications PROCEEDINGS OF THE 2020 GERMAN MICROWAVE CONFERENCE (GEMIC), 2020, : 68 - 71
- [48] Broadband RF Front-End Featuring a Reconfigurable Q-Enhanced Filter for Upper Mid-Band 6G Receivers 2023 21ST IEEE INTERREGIONAL NEWCAS CONFERENCE, NEWCAS, 2023,
- [49] A new thin film passive integration technology for miniaturisation of mobile phone front end modules; Integration of a dual-band power amplifier, switch and diplexer for GSM 2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2000, : 1925 - 1928