Early analysis of cost/performance trade-offs in MCM systems

被引：13
|
作者：
Garg, V
Stogner, DJ
Ulmer, C
Schimmel, DE
Dislis, C
Yalamanchili, S
Wills, DS
机构：
[1] MOTOROLA INC, DIV MOBILE COMMUN, PLANTATION, FL 33322 USA
[2] UNIV READING, DEPT CYBERNET, READING RG6 2AY, BERKS, ENGLAND
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1997年 / 20卷 / 03期
基金：
美国国家科学基金会;
关键词：
advanced packaging; early analysis; MCM; system trade-offs;
D O I：
10.1109/96.618231
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented, The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system and to uncover resources which may be exploited to increase performance of such a system, early in the design process, We describe a prototype tool called IMPACT, which will predict cost, performance, power, and reliability, and present several case studies demonstrating its use.
引用
收藏
页码：308 / 319
页数：12
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