Pulsed Electric Current Bonding of Tungsten to Titanium

被引：0
|
作者：
Kobuchi, Keisuke [1 ]
Nishimoto, Akio [2 ]
机构：
[1] Kansai Univ, Grad Sch Sci & Engn, 3-3-35 Yamate Cho, Suita, Osaka 5648680, Japan
[2] Kansai Univ, Dept Chem & Mat Engn, Osaka 5648680, Japan
来源：
METALLOGRAPHY XV | 2014年 / 782卷
关键词：
pulsed electric current sintering; spark plasma sintering; bonding; tungsten; titanium; AUSTENITIC STAINLESS-STEEL; MICROSTRUCTURE; COATINGS;
D O I：
10.4028/www.scientific.net/MSF.782.445
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Pulsed electric-current sintering was applied to the bonding of tungsten to titanium. The influence of bonding condition on the bond strength of joint was investigated by observing the microstructure. The bonding process was carried out at bonding temperature from 773 to 1273 K for 1.8 ks at a bonding pressure of 40 MPa. The bond strength of the joint bonded at the temperature higher than 1173 K was around 200 MPa. This joint fractured in the tungsten during tensile test. SEM-EDX observation revealed that W diffused into Ti at the joint interface of the joint bonded at the temperature higher than 973 K.
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页码：445 / +
页数：2
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