Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

被引：0
|
作者：
Mu, Fengwen [1 ]
Ren, Hui [2 ]
Liu, Lei [2 ]
Wang, Yinghui [3 ,4 ,5 ]
Zou, Guisheng [2 ]
Suga, Tadatomo [1 ]
机构：
[1] Univ Tokyo, Sch Engn, Dept Precis Engn, Tokyo 1138656, Japan
[2] Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
[3] Chinese Acad Sci, Inst Microelect, Smart Sensing R&D Ctr, Beijing 100029, Peoples R China
[4] Chinese Acad Sci, Inst Microelect, Kunshan Branch, Suzhou 215347, Peoples R China
[5] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
来源：
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) | 2019年
基金：
中国国家自然科学基金;
关键词：
Nano-Cu paste; sintering; bonding; low temperature; Pt -catalyzed formic acid; interface; DIE ATTACH MATERIALS;
D O I：
10.23919/icep.2019.8733407
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.
引用
收藏
页码：365 / 366
页数：2
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