Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

被引：0
|
作者：
Mu, Fengwen [1 ]
Ren, Hui [2 ]
Liu, Lei [2 ]
Wang, Yinghui [3 ,4 ,5 ]
Zou, Guisheng [2 ]
Suga, Tadatomo [1 ]
机构：
[1] Univ Tokyo, Sch Engn, Dept Precis Engn, Tokyo 1138656, Japan
[2] Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
[3] Chinese Acad Sci, Inst Microelect, Smart Sensing R&D Ctr, Beijing 100029, Peoples R China
[4] Chinese Acad Sci, Inst Microelect, Kunshan Branch, Suzhou 215347, Peoples R China
[5] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
来源：
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) | 2019年
基金：
中国国家自然科学基金;
关键词：
Nano-Cu paste; sintering; bonding; low temperature; Pt -catalyzed formic acid; interface; DIE ATTACH MATERIALS;
D O I：
10.23919/icep.2019.8733407
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.
引用
收藏
页码：365 / 366
页数：2
相关论文
共 50 条
  • [1] Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature
    Mu, Fengwen
    Ren, Hui
    Liu, Lei
    Wang, Yinghui
    Zou, Guisheng
    Suga, Tadatomo
    2019 International Conference on Electronics Packaging, ICEP 2019, 2019, : 365 - 366
  • [2] Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
    Mu, Fengwen
    Ren, Hui
    Shin, Seongbin
    Masatake, Akaike
    Liu, Lei
    Zou, Guisheng
    Makoto, Yoshida
    Suga, Tadatomo
    PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2019, : 53 - 53
  • [3] Sintering of Cu particles baked by formic acid vapor for Cu-Cu low temperature bonding
    Liu, Sushi
    Yang, Le
    Xin, Jianbo
    Lv, Xiaochun
    Chen, Yi
    Liu, Yang
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (22)
  • [4] Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor
    He, Liangliang
    Li, Junlong
    Wu, Xin
    Mu, Fengwen
    Wang, Yinghui
    Lu, Yangting
    Suga, Tadatomo
    METALS, 2020, 10 (03)
  • [5] Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere
    Ying Meng
    Yang Xu
    Runhua Gao
    Xinhua Wang
    Xiaojuan Chen
    Sen Huang
    Ke Wei
    Dahai Wang
    Haibo Yin
    Kai Takeuchi
    Tadatomo Suga
    Fengwen Mu
    Xinyu Liu
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 2582 - 2589
  • [6] Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere
    Meng, Ying
    Xu, Yang
    Gao, Runhua
    Wang, Xinhua
    Chen, Xiaojuan
    Huang, Sen
    Wei, Ke
    Wang, Dahai
    Yin, Haibo
    Takeuchi, Kai
    Suga, Tadatomo
    Mu, Fengwen
    Liu, Xinyu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (05) : 2582 - 2589
  • [7] Sintering of mixed Cu-Ag nanoparticles pretreated by formic acid vapor for Cu-Cu low temperature bonding
    Yang, Wenhua
    Wu, Chunyan
    Xie, Chao
    Huang, Zhixiang
    MICROELECTRONICS RELIABILITY, 2023, 141
  • [8] Formic Acid Vapor Treated Cu-Cu Direct Bonding at Low Temperature
    Yang, Wenhua
    Shintani, Hiroyuki
    Akaike, Masatake
    Suga, Tadatomo
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 72 - 75
  • [9] Low Temperature Cu-Cu Direct Bonding using Formic Acid Vapor Pretreatment
    Yang, Wenhua
    Shintani, Hiroyuki
    Akaike, Masatake
    Suga, Tadatomo
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 2079 - 2083
  • [10] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature
    Suga, Tadatomo
    Masakate, Akaike
    Yang, Wenhua
    Matsuoka, Naoya
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 644 - 647
12345